JPS6116688Y2 - - Google Patents
Info
- Publication number
- JPS6116688Y2 JPS6116688Y2 JP10921480U JP10921480U JPS6116688Y2 JP S6116688 Y2 JPS6116688 Y2 JP S6116688Y2 JP 10921480 U JP10921480 U JP 10921480U JP 10921480 U JP10921480 U JP 10921480U JP S6116688 Y2 JPS6116688 Y2 JP S6116688Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrode plate
- support plate
- thickness
- semiconductor device
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 11
- 239000008188 pellet Substances 0.000 claims description 11
- 229910052710 silicon Inorganic materials 0.000 claims description 11
- 239000010703 silicon Substances 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 2
- 230000006866 deterioration Effects 0.000 description 6
- 238000005219 brazing Methods 0.000 description 5
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009661 fatigue test Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10921480U JPS6116688Y2 (en]) | 1980-08-01 | 1980-08-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10921480U JPS6116688Y2 (en]) | 1980-08-01 | 1980-08-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5735038U JPS5735038U (en]) | 1982-02-24 |
| JPS6116688Y2 true JPS6116688Y2 (en]) | 1986-05-22 |
Family
ID=29470416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10921480U Expired JPS6116688Y2 (en]) | 1980-08-01 | 1980-08-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6116688Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5964792U (ja) * | 1982-10-21 | 1984-04-28 | 積水プラントシステム株式会社 | 蓋を備えた組立式タンク |
-
1980
- 1980-08-01 JP JP10921480U patent/JPS6116688Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5735038U (en]) | 1982-02-24 |
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